summary v ceo = 20v; r sat = 47m ;i c = 4.5a description packaged in the innovative 2mm x 2mm mlp (micro leaded package) outline, this new 4 th generation low saturation transistor offers extremely low on state losses making it ideal for use in dc-dc circuits and various driving and power management functions. additionally users will also gain several other key benefits: performance capability equivalent to much larger packages improved circuit efficiency & power levels lower package height (nom 0.9mm) pcb area and device placement savings reduced component count features ? low equivalent on resistance ? extremely low saturation voltage (150mv @1a) ? h fe specified up to 6a ? i c = 4.5a continuous collector current ? 2mm x 2mm mlp applications ? dc - dc converters (fet drivers) ? power switches ? motor control ? led backlighting device marking sb zxtbm322 issue 2 - june 2002 1 mpps? miniature package power solutions 20v npn low saturation transistor device reel tape width quantity per reel zxtbm322ta 7 ?? 8mm 3000 units ZXTBM322TC 13 ?? 8mm 10000 units ordering information 2mm x 2mm single mlp underside view pinout 2mm x 2mm mlp (single die) b c e obsolete - please use zxtn618ma
zxtbm322 issue 2 - june 2002 2 parameter symbol value unit junction to ambient (a) r ja 83 c/w junction to ambient (b) r ja 51 c/w junction to ambient (d) r ja 125 c/w junction to ambient (e) r ja 42 c/w thermal resistance notes (a) for a single device surface mounted on 10sq cm1oz copper on fr4 pcb in still air conditions with all exposed pads attached . (b) for a single device surface mounted on 10sq cm1oz copper on fr4 pcb in still air conditions measured at t 5 secs with all exposed pads attached. (c) repetitive rating - pulse width limited by max junction temperature. refer to transient thermal impedance graph. (d) for a single device surface mounted on 10sq cm1oz copper on fr4 pcb in still air conditions with minimal lead connections only . (e) for a single device surface mounted on 65sq cm2oz copper on fr4 pcb in still air conditions with all exposed pads attached . (f) the minimum copper dimensions required for mounting are no smaller than the exposed metal pads on the base of the device, as shown in the package dimensions data. the thermal resistance for a device mounted on 1.5mm thick fr4 board using minimum copper of 1oz weight is rth=300c/w giving a power rating of ptot=420mw. parameter symbol limit unit collector-base voltage v cbo 40 v collector-emitter voltage v ceo 20 v emitter-base voltage v ebo 7.5 v peak pulse current (c) i cm 12 a continuous collector current (a) i c 4.5 a continuous collector current (b) i c 5a base current i b 1000 ma power dissipation at ta=25c (a) linear derating factor p d 1.5 12 w mw/c power dissipation at ta=25c (b) linear derating factor p d 2.45 19.6 w mw/c power dissipation at ta=25c (d) linear derating factor p d 1 8 w mw/c power dissipation at ta=25c (e) linear derating factor p d 3 24 w mw/c operating and storage temperature range t j :t stg -55 to +150 c absolute maximum ratings. obsolete - please use zxtn618ma
zxtbm322 issue 2 - june 2002 3 0.1 1 10 0.01 0.1 1 10 0 25 50 75 100 125 150 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 100 1m 10m 100m 1 10 100 1k 0 20 40 60 80 0.1 1 10 100 0 25 50 75 100 125 150 175 200 225 0.1 1 10 100 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 100us 100ms 1s v ce(sat) limited 1ms safe operating area single pulse, t amb =25c dc 10ms i c collector current (a) v ce collector-emitter voltage (v) 1oz cu note: a 2oz cu note: e derating curve t amb =25c max power dissipation (w) temperature (c) d=0.2 d=0.5 d=0.1 transient thermal impedance single pulse d=0.05 thermal resistance (c/w) pulse width (s) thermal resistance v board area 1oz copper 2oz copper thermal resistance (c/w) boardcuarea(sqcm) 1oz copper 2oz copper power dissipation v board area t amb =25c t jmax =150c continuous p d dissipation (w) boardcuarea(sqcm) typical characteristics obsolete - please use zxtn618ma
zxtbm322 issue 2 - june 2002 4 parameter symbol min. typ. max. unit conditions. collector-base breakdown voltage v (br)cbo 40 100 v i c =100 a collector-emitter breakdown voltage v (br)ceo 20 27 v i c =10ma* emitter-base breakdown voltage v (br)ebo 7.5 8.2 v i e =100 a collector cut-off current i cbo 25 na v cb =32v emitter cut-off current i ebo 25 na v eb =6v collector emitter cut-off current i ces 25 na v ces =16v collector-emitter saturation voltage v ce(sat) 8 90 115 190 210 15 150 135 250 270 mv mv mv mv mv i c =0.1a, i b =10ma* i c =1a, i b =10ma* i c =2a, i b =50ma* i c =3a, i b =100ma* i c =4.5a, i b =125ma* base-emitter saturation voltage v be(sat) 0.98 1.05 v i c =4.5a, i b =125ma* base-emitter turn-on voltage v be(on) 0.88 0.95 v i c =4.5a, v ce =2v* static forward current transfer ratio h fe 200 300 200 100 400 450 360 180 i c =10ma, v ce =2v* i c =0.2a, v ce =2v* i c =2a, v ce =2v* i c =6a, v ce =2v* transition frequency f t 100 140 mhz i c =50ma, v ce =10v f=100mhz output capacitance c obo 23 30 pf v cb =10v, f=1mhz turn-on time t (on) 170 ns v cc =10v, i c =3a i b1 =i b2 =10ma turn-off time t (off) 400 ns electrical characteristics (at t amb = 25c unless otherwise stated). *measured under pulsed conditions. pulse width=300 s. duty cycle 2% obsolete - please use zxtn618ma
zxtbm322 issue 2 - june 2002 5 1m 10m 100m 1 10 1m 10m 100m 1m 10m 100m 1 10 0.00 0.05 0.10 0.15 0.20 0.25 1m 10m 100m 1 10 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1m 10m 100m 1 10 0.4 0.6 0.8 1.0 1m 10m 100m 1 10 0.4 0.6 0.8 1.0 0 90 180 270 360 450 540 630 v ce(sat) vi c tamb=25c i c /i b =100 i c /i b =50 i c /i b =10 v ce(sat) (v) i c collector current (a) v be(sat) vi c i c /i b =50 100c 25c -55c v ce(sat) (v) i c collector current (a) h fe vi c v ce =2v -55c 25c 100c normalised gain i c collector current (a) 25c v ce(sat) vi c i c /i b =50 100c -55c v be(sat) (v) i c collector current (a) v be(on) vi c v ce =2v 100c 25c -55c v be(on) (v) i c collector current (a) typical gain (h fe ) typical characteristics obsolete - please use zxtn618ma
zxtbm322 issue 2 - june 2002 6 europe zetex plc fields new road chadderton oldham, ol9 8np united kingdom telephone (44) 161 622 4422 fax: (44) 161 622 4420 uksales@zetex.com zetex gmbh streitfeldstra?e 19 d-81673 mnchen germany telefon: (49) 89 45 49 49 0 fax: (49) 89 45 49 49 49 europe.sales@zetex.com americas zetex inc 700 veterans memorial hwy hauppauge, ny11788 usa telephone: (631) 360 2222 fax: (631) 360 8222 usa.sales@zetex.com asia pacific zetex (asia) ltd 3701-04 metroplaza, tower 1 hing fong road kwai fong hong kong telephone: (852) 26100 611 fax: (852) 24250 494 asia.sales@zetex.com these offices are supported by agents and distributors in major countries world-wide. this publication is issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. the company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. for the latest product information, log on to www.zetex.com ? zetex plc 2002 controlling dimensions in millimetres approx. converted dimensions in inches mlp322 package outline (2mm x 2mm micro leaded package) dim millimetres inches dim millimetres inches min. max. min. max. min. max. min. max. a 0.80 1.00 0.0315 0.0393 e 0.65 ref 0.0255 ref a1 0.00 0.05 0.00 0.002 e 2.00 bsc 0.0787 bsc a2 0.65 0.75 0.0255 0.0295 e2 0.79 0.99 0.031 0.039 a3 0.15 0.25 0.0059 0.0098 e4 0.48 0.68 0.0188 0.0267 b 0.18 0.28 0.0070 0.0110 l 0.20 0.45 0.0078 0.0177 b1 0.17 0.30 0.0066 0.0118 l2 0.125 max. 0.005 ref d 2.00 bsc 0.0787 bsc r 0.075 bsc 0.0029 bsc d2 1.22 1.42 0.0480 0.0559 0 12 0 12 d4 0.56 0.76 0.0220 0.0299 package dimensions obsolete - please use zxtn618ma
|
